Advancements in electronics design and manufacture, as well as the general trend toward optimization on all fronts – size, weight, power, and cost (also known as SWAP-C) have put a lot of pressure on electronics designers in recent years. These include a push for miniaturization and modularity for devices with increased thermal performance and power...
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Low-k Dielectrics for Semiconductor Applications
GVD’s Exilis is a proprietary CVD polymer that exhibits unparalleled conformality and protects in harsh environments.
Exilis was developed in support of DARPA’s heterogeneous integration programs, and may be applied on chip, wafer, or device level.
Surface agnostic, micron thin and ultra-conformal
Deposited using a contactless chemical vapor deposition (CVD) process and uniquely suited for miniaturized, geometrically complex, and high-density structures with aspect ratio features of over 50:1.
Low-k material with a high dielectric strength
Exhibits superior dielectric properties ideal for ultra-thin insulation, even at high RF and microwave frequencies.
Enables reliability in moisture-rich environments
A robust, protective film provides environmental protection and survives 1000 hours of temperature-humidity-bias (THB) testing at only hundreds of nanometers.
Thermally and chemically stable
Withstands continuous temperatures of up to 265°C and well-suited to challenging manufacturing conditions.
Exilis Properties
| Material Overview | |
|---|---|
|
Appearance |
Smooth, transparent, and free of blisters, cracking, peeling, or wrinkles |
|
Continuous Operating Temperature Range |
-70°C to 265°C |
|
Typical Thickness |
300 - 1000 nm |
| Material Properties | ||
|---|---|---|
|
85°C/85 RH THB Test |
JESD-22-A101C, 1000 hours |
Pass |
|
Vacuum Stability & Outgassing |
ASTM E595 |
Meets the historical TML and CVCM |
|
Dielectric Constant |
MDC Mercury Probe @ 1MHz |
2.62 |
|
Dissipation Factor |
MDC Mercury Probe @ 1MHz |
<0.001 |
|
Dielectric Strength |
MDC Mercury Probe @ 1MHz |
7200 V/mil |
|
Young’s Modulus |
Nanoindentation |
<3.4 GPa |
|
Conformality |
Misc. |
Aspect ratios up to 50:1 |
Exilis is Ideal For:
3DHI Microsystems
Wafer-Level Packaging (WLP) Technologies
Microelectromechanical Systems (MEMS)
SiP (system-in-package) Technologies
Application Spotlight
Maximizing Droplet Motion for Microfluidics Applications
Electrowetting has emerged as one of the most commonly used techniques for manipulating the movement of small liquid droplets on surfaces, utilized in lab-on-a-chip devices, optics, and displays. It is achieved via electromechanical reduction of a liquid’s contact angle with an applied electric field on a solid surface. An electrowetting material system will typically consist...
Read MoreApplication Spotlight
Facilitating Advanced Packaging and Heterogeneous Integration
Advancements in electronics design and manufacture, as well as the general trend toward optimization on all fronts – size, weight, power, and cost (also known as SWAP-C) have put a lot of pressure on electronics designers in recent years. These include a push for miniaturization and...
Read MoreMaximizing Droplet Motion for Microfluidics Applications
Electrowetting has emerged as one of the most commonly used techniques for manipulating the movement of small liquid droplets on surfaces, utilized in lab-on-a-chip devices, optics, and displays. It is achieved via electromechanical reduction of a liquid’s contact angle with an applied electric field on a...
Read MoreGVD Helps You Move Quickly From Evaluation to Production
When you choose GVD for your project, you’ll work directly with our coating specialists for R&D collaboration through to production-scale coating services. Our coating service is scalable to fit your requirements from the evaluation phase through to high volume manufacturing.
Evaluate
Test different coating technologies and processes on a small number of units.
Validate
Coat engineering volumes for in-depth evaluation.
Scale
GVD can quickly scale up and transfer coating operations to customer’s facility via technology licensing.
Exilis FAQs
While we do not have an exhaustive list of chemical compatibility testing on file, the coating is expected to be chemically stable in the presence of a variety of substances, and insoluble in typical solvents due to its densely cross-linked structure. If needed, we are happy to review substances on a case-by-case basis, or provide samples for testing.
The coating is robust and easily withstands regular handling/rubbing. However, because it’s a thin film of 1 um or less, it will get damaged if a sharp object is used repeatedly to scratch the surface.
We do not explicitly check for pinholes batch to batch. Due to the nature of the (CVD) deposition process, pinholes are unlikely. One of the biggest factors that can affect coating performance is surface contamination; therefore, a clean and residue-free surface is critical to the adhesion of the Exilis coating.
The coating is fully polymerized post-deposition, and does not require any additional steps once the recipe is complete.
Due to the nature of the CVD process, all critical process parameters are tightly controlled and highly repeatable.
Yes!
I’d like to discuss how Exilis can help us provide highly conformal electrical insulation in harsh environments
